Product Benefits
- High purity
- Non-conductive
- Excellent protection of electrical joints
- Compatible with small assembly gap and tight pitches
LOCTITE ECCOBOND FP 5201 10cc sy
Part number: 1439779£414.30 ex.VAT (£497.16 inc.VAT)
LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly.
Available to order. Your estimated delivery is: 30/12/2023
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
- Technology BMI/Acrylate
- Components One-component
- Cure Heat cure
- Application Underfill
- Metal Interconnect Gold, Solder and Cu pillar
- Substrates Solder, Gold and Cu pads on fine pitch laminate
LOCTITE-ECCOBOND-FP-5201-TDS.pdf
Size: 63.81 kB
Type: pdf
| Weight | 0.016 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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