£348.36 ex.VAT (£418.03 inc.VAT)
LOCTITE ECCOBOND FP4450, Epoxy, Encapsulant.
Available to order. Your estimated delivery is: 24/01/2024
LOCTITE ECCOBOND FP4450 encapsulant is designed for protection of bare semiconductor devices. It offers pressure pot performance on live devices up to 500 hours with no failures, depending upon the device and package type. A cavity or potting dam is required for flow control. Please refer to the TDS for alternate cure schedules.
| Coefficient of Thermal Expansion (CTE), Below Tg | 22.0 ppm/°C |
| Colour | Black |
| Cure Schedule, Alternate @ 165.0 °C | 90.0 min. |
| Cure Schedule, Recommended @ 125.0 °C | 30.0 min. |
| Cure Type | Heat Cure |
| Filler | 73.0 % |
| Glass Transition Temperature (Tg) | 155.0 °C |
| Operating Temperature | -65.0 - 150.0 °C |
| Specific Gravity, @ 25.0 °C | 1.77 |
| Storage Temperature | -40.0 °C |
| Viscosity, Brookfield - RVT, @ 25.0 °C Spindle 7, speed 20 rpm | 43900.0 mPa·s (cP) |
| Weight | 0.282 kg |
|---|---|
| package size |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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