LOCTITE ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.
- Excellent wettability
- Excellent adhesion
- Low viscosity
- Fast flow
£84.78 ex.VAT (£101.74 inc.VAT)
LOCTITE ECCOBOND FP4526, Epoxy, Underfill.
Available to order. Your estimated delivery is: 13/01/2024
LOCTITE ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications.
Coefficient of Thermal Expansion (CTE), Above Tg | 101.0 ppm/°C |
Coefficient of Thermal Expansion (CTE), Below Tg | 33.0 ppm/°C |
Cure Schedule, @ 165.0 °C | 15.0 min. |
Flexural Modulus | 8500.0 N/mm² (1232500.0 psi ) |
Glass Transition Temperature (Tg) | 133.0 °C |
Viscosity, Brookfield Cone & Plate, @ 25.0 °C Spindle 52, speed 10 rpm | 4700.0 mPa·s (cP) |
Product Type | Industrial Adhesives,Underfills,Compounds for Electronics |
Size: 67.70 kB
Type: pdf
Weight | 0.017 kg |
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package size |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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