LOCTITE ECCOBOND FP4549 10ml

This material is formulated to quickly underfill devices at 90°C to 110°C with as little as a 1/2 mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.

Product Benefits

• High purity
• Low stress
• Low moisture absorption
• Extends thermal cycling performance
• Dissipates stress on solder joints
• Improved JEDEC performance