This material is formulated to quickly underfill devices at 90°C to 110°C with as little as a 1/2 mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.
- High purity
- Low stress
- Low moisture absorption
- Extends thermal cycling performance
- Dissipates stress on solder joints
- Improved JEDEC performance