£95.93 ex.VAT (£115.12 inc.VAT)
LOCTITE ECCOBOND UF 3800, Epoxy, Underfill.
Available to order. Your estimated delivery is: 19/01/2024
LOCTITE ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
| Coefficient of Thermal Expansion (CTE), Above Tg | 188.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Below Tg | 52.0 ppm/°C |
| Cure Schedule, @ 130.0 °C | 8.0 min. |
| Glass Transition Temperature (Tg) | 69.0 °C |
| Viscosity, Physica MCR100 @ 25.0 °C Spindle CP50-1 | 375.0 mPa·s (cP) |
Size: 65.94 kB
Type: pdf
| Weight | 0.034 kg |
|---|---|
| package size |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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