This material can underfill devices with 25 µm geometries. LOCTITE ECCOBOND UF 3831 provides a uniform and void-free encapsulant underfill designed to maximixe the device’s temperature cycling capability thus distributing stress away from solder connects.
LOCTITE ECCOBOND UF 3831 30CCPart number: 2561420
£228.22 ex.VAT (£273.86 inc.VAT)
LOCTITE ECCOBOND UF 3831 is a low viscosity material formulated to flow at room temperature.
Available to order. Your estimated delivery is: 27/01/2024
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