This material can underfill devices with 25 µm geometries. LOCTITE ECCOBOND UF 3831 provides a uniform and void-free encapsulant underfill designed to maximixe the device’s temperature cycling capability thus distributing stress away from solder connects.
LOCTITE ECCOBOND UF 3831 30CC
Part number: 2561420£228.22 ex.VAT (£273.86 inc.VAT)
LOCTITE ECCOBOND UF 3831 is a low viscosity material formulated to flow at room temperature.
Available to order. Your estimated delivery is: 27/01/2024
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
- Technology Epoxy
- Appearance Black liquid
- Cure Heat cure
- Application Underfill, Encapsulation
- Typical Package Application CSP, BGA and WLCSP
LOCTITE-ECCOBOND-UF-3831-TDS.pdf
Size: 65.06 kB
Type: pdf
| Weight | 0.042 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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