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LOCTITE ECCOBOND UF 8807 30cc sy
Part number: 1454433£379.61 ex.VAT (£455.53 inc.VAT)
LOCTITE ECCOBOND UF 8807 is a one component, high-flow liquid underfill encapsulant with superior moisture resistance.
Available to order. Your estimated delivery is: 28/10/2023
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe. 
This material’s characteristics help to reduce thermal and mechanical stresses between CSP packages and HDI substrates in MPM applications. An optimized particle size distribution allows LOCTITE ECCOBOND UF 8807 adhesive to flow rapidly into gaps of 10 mils and greater to form a protective polymer when cured.
- Technology Cyanate Ester
- Cure Heat cure
- Filler Type Silica
- Application Encapsulant
- Typical Package Application CSP, HDI and MPM
- Key Substrates Organic substrates Percent Solids, % 63.5
LOCTITE-ECCOBOND-UF-8807-TDS.pdf
Size: 67.36 kB
Type: pdf
| Weight | 0.051 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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