LOCTITE ECCOBOND UF 8830S 10cc
Part number: 2017490£40.61 ex.VAT (£48.73 inc.VAT)
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications.
Available to order. Your estimated delivery is: 02/05/2023
Free shipping on orders over £75
Same day dispatch if you place your order before 3.30pm
Manufacturer CofC available at checkout
Please note packaging may vary
Click here to see full delivery details for UK Mainland, Highlands and Islands, and Europe.
It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.
- Improved toughness
- Low CTE
- High purity
- High TG
| Coefficient of Thermal Expansion (CTE), Above Tg | 100.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Below Tg | 25.0 ppm/°C |
| Glass Transition Temperature (Tg) | 118.0 °C |
| Storage Modulus, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| Storage Temperature | -40.0 °C |
| Viscosity, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa·s (cP) |
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LOCTITE-ECCOBOND-UF-8830S-TDS.pdf
Size: 64.84 kB
Type: pdf
| Weight | 0.016 kg |
|---|---|
| package size |
Delivery info
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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