£137.14 ex.VAT (£164.57 inc.VAT)
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications.
Available to order. Your estimated delivery is: 10/01/2024
It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.
| Coefficient of Thermal Expansion (CTE), Above Tg | 100.0 ppm/°C |
| Coefficient of Thermal Expansion (CTE), Below Tg | 25.0 ppm/°C |
| Glass Transition Temperature (Tg) | 118.0 °C |
| Storage Modulus, DMA @ 25.0 °C | 11500.0 N/mm² (1667934.0 psi ) |
| Storage Temperature | -40.0 °C |
| Viscosity, Brookfield, @ 25.0 °C Spindle 51, Speed 5 rpm | 22120.0 mPa·s (cP) |
Size: 64.84 kB
Type: pdf
| Weight | 0.016 kg |
|---|---|
| package size |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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