LOCTITE STYCAST SI 5225 D1.3 features primerless adhesion when heat cured thus using fewer processing steps than materials that require the use of a surface primer.
Product Benefits
- Flexible when cured
- Primerless adhesion
- High temperature resistance
£3,119.91
LOCTITE STYCAST SI 5225 D1.3 liquid encapsulant is designed for the encapsulation of electronic devices requiring a low viscosity material.
LOCTITE STYCAST SI 5225 D1.3 features primerless adhesion when heat cured thus using fewer processing steps than materials that require the use of a surface primer.
Size: 69.92 kB
Type: pdf
Weight | N/A |
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Packaging | PTA, cn, PTB, cn |
type |
Shipment method | Shipment cost |
Click and Collect | FREE |
Next day (orders above £75.00 ex.vat) | FREE |
Next day (orders below £75.00 ex.vat) | £6.99 |
Next day pre 12AM | £17.99 |
Next day pre 10AM | £20.99 |
Saturday AM | £45.00 |
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