This material offers the application ease of a thermal grease material. It is suitable for use between any heat-generating component and a heat sink or as a thermal solution where the designer is looking for a superior TIM2 replacement. LOCTITE TCP 7800NC is supplied in jars. Other packaging formats are available upon request.
Typical Assembly Applications:
- Microprocessors, GPUs, Multichip modules, ASICs, IGBT, FBDIMM/Memory, Lidded processor applications and Active heat sinks in electronic applications
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