BERGQUIST® LIQUI BOND TLB SA3500 is a thermally conductive, high performance adhesive material that, after mixing, begins to cure at room temperature but can also be accelerated by using heat. Once cured, this product maintains an excellent structural bond that can withstand severe environmental conditions and eliminates the need for mechanical fasteners. The mild elastic properties of the product assist in relieving Coefficient of Thermal Expansion (CTE) stresses during thermal cycling.
- Eliminates need for mechanical fasteners
- Thermal Conductivity: 3.5 W/m-K
- Maintains structural bond in severe-environment applications
- Room Temperature Storage
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